Rating AI supply chain bottlenecks: Interview with @bubbleboi

The semiconductor industry faces structural supply constraints driven by the rapid expansion of AI compute requirements. HBM pricing remains moderate because it relies on existing DRAM wafers, yet this creates a "fixed pie" scenario that exacerbates commodity DRAM shortages. Advanced packaging has emerged as the new Moore's Law, with Intel’s E-MIDT technology positioning it as a critical player alongside TSMC. Power delivery and cooling represent the next major bottlenecks, as chip power draws are projected to double with each generation, necessitating innovations like 800-volt DC architectures and advanced liquid cooling. Meanwhile, the industry is shifting toward specialized AI accelerators and memory-centric designs, such as high-bandwidth flash, to bypass traditional memory bottlenecks and reduce reliance on established DRAM suppliers. These technical shifts are forcing a fundamental rethink of computer architecture at the rack scale.